WLP/PLP Photoresist Removal Equipment
- Specification/Type: HDPR-WLP1000-300/HDPR-PLP1000-500
- Substrate size: 200-300mm wafer/ 510mm*510mm
- Number of chamber: 2-4/ 2
- Transfer system: 5-axis dual arm robot
- Apply for 200/300mm wafer and panel type
- 2 or 4 process chamber stations
- Stable transfer system
- Choice of 3 different process modules: Microwave downstream, RF bias or dual source
- Unique flow field design
- Excellent temperature uniformity and stability
- Fully digital control and SECS/GEM compliant
- Windows based industrial computer equipped
- High throughput with compact design to achieve the best price performance
- Bulk PR stripping
- Descum
- Polymer removal
- Silicon Nitride etching
- MEMS application
- Advanced-packaging processing (PR, PI, BCB, PBO)
Back to top
