PI Oven for Flexible Display
- Substrate size:G2~G6
- MAX. temperature:600℃
- Temperature uniformity:±4℃
- Ramp-up/ramp-down speed:≧8℃/min.
- O2 control:≦100ppm
- Auto solvent burn off function
- Quick ramp-up with IR heater
- Excellent temperature uniformity
- N2 recovery system
- Solvent treatment system
- Integrate with optional VOTGS (Volatile Organic Gases Treatment System) can reduce process contaminant and ambient smelling
- Fully automated capable
- Real time monitor of substrate temperature
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